Tantalum nitride
| Names | |
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| Other names
Tantalum mononitride
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| Identifiers | |
3D model (JSmol)
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| ChemSpider | |
| ECHA InfoCard | 100.031.613 |
| EC Number |
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PubChem CID
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CompTox Dashboard (EPA)
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| Properties | |
| TaN | |
| Molar mass | 194.955 g/mol |
| Appearance | black crystals |
| Density | 14.3 g/cm3 |
| Melting point | 3,090 °C (5,590 °F; 3,360 K) |
| insoluble | |
| Thermal conductivity | 1100 W/(m·K) (metallic theta phase) |
| Structure | |
| Hexagonal, hP6 | |
| P62m, No. 189 | |
| Hazards | |
| Flash point | Non-flammable |
| Related compounds | |
Other cations
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Vanadium nitride Niobium nitride |
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
Infobox references
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Tantalum nitride (TaN) is a chemical compound, a nitride of tantalum. There are multiple phases of compounds, stoichimetrically from Ta2N to Ta3N5, including TaN.
As a thin film TaN find use as a diffusion barrier and insulating layer between copper interconnects in the back end of line of computer chips. Tantalum nitrides are also used in thin film resistors.